2

Flip chip packaging for MEMS microphones

Year:
2010
Language:
english
File:
PDF, 423 KB
english, 2010
4

A new SO2 sensor system with SAW and IDC elements

Year:
1996
Language:
english
File:
PDF, 634 KB
english, 1996
9

Acoustic Frontend Modules

Year:
2005
Language:
english
File:
PDF, 703 KB
english, 2005